Thermal Paste

Thermal paste is a paste-like thermal interface material applied between a heat-generating component and a cooling surface. In mining hardware, it can be used between ASIC chips and heatsinks or other heat-transfer elements.

Chip and heatsink surfaces contain microscopic irregularities. Without an interface material, small air gaps remain between the surfaces. Thermal paste fills these gaps and provides a more effective thermal path.

How Thermal Paste Affects Cooling

Thermal paste does not cool the chip by itself. Its purpose is to reduce thermal resistance between the heat source and the heatsink. The heatsink or cooling block then transfers the heat into air or coolant.

Why Layer Thickness Matters

The purpose of thermal paste is to fill microscopic surface irregularities rather than create a thick thermal layer. Excessive paste does not automatically improve cooling and can increase the distance through which heat must travel.

Maintenance

Thermal paste can change over time due to prolonged exposure to heat. It may dry out, migrate, or lose some of its ability to maintain an effective contact layer.

When servicing ASIC equipment, the correct application method depends on the board and cooling assembly design. Incorrect application can produce uneven thermal contact and temperature differences between individual chips.